The Google Pixel lineup has carved its niche in the smartphone market, lauded for its clean software experience and exceptional camera capabilities. However, one area where Pixel phones have historically lagged behind competitors is processor performance. This might be changing with the upcoming Pixel 10, as reports suggest Google is switching chip manufacturers, potentially paving the way for a performance leap.
TSMC Takes the Reins: A Departure from Samsung
Recent leaks and evidence discovered in public trade databases, reported by Android Authority, hint at a significant shift in Google’s strategy for the Pixel 10. It appears Google might be ditching Samsung, their long-term partner for Pixel phone chip production, and entrusting the manufacturing of the next-generation Tensor G5 chip to Taiwan Semiconductor Manufacturing Company (TSMC).
This move signifies a critical change as Google previously relied on Samsung’s foundries to manufacture its custom Tensor processors. While collaborating with Samsung has allowed Google to develop its processors in a shorter timeframe with fewer engineers, it also meant being confined to Samsung’s technologies.
Decoding the Evidence: LGA, A0, and InFO POP
The trade database reveals details about a sample Tensor G5 chip codenamed “Laguna Beach” (LGA). This code system aligns with Google’s past practices, where previous chips like the Tensor G1 (“Whitechapel”) and Tensor G4 (“Zuma Pro”) used similar internal codenames (WHI and ZPR, respectively).
The information also mentions TSMC’s involvement and their InFO (Integrated Fan-Out) POP (Package-on-Package) technology. Info POP is a cutting-edge packaging technique that allows for stacking multiple chips on top of each other in a single package. This can lead to a more compact design and potentially improved performance. The presence of these details in the database further strengthens the possibility of a switch from Samsung to TSMC for the Pixel 10’s Tensor G5 chip.
Under Construction: Early Development Stages
The chip identified in the database is marked as revision “A0,” indicating it’s an early version in the development cycle. This signifies there’s likely to be further refinement and potential future revisions before the final version is ready for mass production. Additionally, the label “OTP, V1” suggests it’s the first iteration of the one-time programmable data. This allows Google to modify certain chip parameters without altering the core structure, potentially for fine-tuning performance and efficiency.
The “NPI-OPEN” label on the chip signifies it’s currently undergoing the New Product Introduction (NPI) phase. During this crucial stage, the manufacturing processes are meticulously optimized to ensure consistent and high-quality production of the final product.
Testing and Building Blocks: Ensuring a Smooth Launch
The trade database also reveals that the chip has successfully passed essential functionality tests, including the system-level test (SLT). This early testing ensures the chip’s basic functionalities are working as expected. With an estimated release window for the Pixel 10 approximately 16 months from now, early sampling of the Tensor G5 chip is crucial to identify and address any potential issues before mass production.
Interestingly, the details also mention 16GB of package-on-package RAM from Samsung Electronics Co. This aligns with rumors suggesting a potential RAM upgrade in the upcoming Pixel 9 Pro. While the Pixel 9 might not benefit from the TSMC-manufactured Tensor G5 chip, it could pave the way for a performance boost in the Pixel 10 series.
Export and Potential Implications: A Shift in Strategy
The trade data lists Google LLC in Taiwan as the exporter and Tessolve Semiconductor in India as the importer. Tessolve specializes in semiconductor solutions, hinting that Google might be outsourcing some tasks previously handled by Samsung in-house. This potential shift in strategy could streamline the production process and potentially lead to cost efficiencies.
The move from Samsung to TSMC for the Pixel 10’s Tensor G5 chip has generated significant excitement among tech enthusiasts. TSMC is a leader in chip manufacturing, renowned for its cutting-edge technology and superior production efficiency. This shift could translate into a significant performance leap for the Pixel 10, potentially placing it on par with the top offerings from Qualcomm and MediaTek.
While the detailed specifications and performance capabilities of the Pixel 9’s Tensor G4 chip will likely be revealed closer to its expected launch in October 2024, the potential of the TSMC-manufactured Tensor G5 chip has piqued the interest of Pixel fans worldwide.
FAQs
What is the Tensor G5 chip?
The Tensor G5 is Google’s next-generation chip designed for the Pixel 10 smartphone. It is expected to offer improved performance and efficiency compared to its predecessors.
Why is Google switching from Samsung to TSMC?
Google is reportedly switching to TSMC for its chip production to leverage TSMC’s advanced manufacturing processes, which could result in better performance and efficiency for the Tensor G5 chip.
What are the benefits of the Tensor G5 chip being manufactured by TSMC?
The switch to TSMC is expected to deliver significant performance improvements, better power efficiency, and enhanced features for the Pixel 10 smartphone.
What does the codename “Laguna Beach” signify?
“Laguna Beach” is the codename for the sample Tensor G5 chip, following Google’s past naming conventions for its chips.
When is the Pixel 10 expected to be released?
The Pixel 10, featuring the Tensor G5 chip, is estimated to be released approximately 16 months from now, likely in late 2025.
