MediaTek to Launch Dimensity 9500 Flagship SoC on September 22, 2025
MediaTek has announced the official launch date of its latest flagship processor, the Dimensity 9500 SoC, which is scheduled for September 22, 2025. Featuring cutting-edge TSMC 2nm N2P manufacturing technology, the Dimensity 9500 is one of the first chips to leverage this advanced process, offering significant improvements in power efficiency and performance compared to previous generations.
This next-gen SoC is poised to power the upcoming flagship smartphones from brands like Vivo and Oppo, setting new benchmarks for Android performance in the latter half of 2025.
Advanced Manufacturing: TSMC’s 2nm N2P Process
MediaTek collaborated with TSMC to design the Dimensity 9500 using the N2P 2nm process node, which boasts:
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Up to 18% higher performance at the same power level compared to the N3E 3nm process.
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Up to 36% lower power consumption at the same clock speed, delivering longer battery life.
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A 1.2× increase in logic density, enabling more powerful chip designs in a smaller size.
This nanosheet transistor-based technology represents a huge leap forward in semiconductor efficiency and capability.
MediaTek Dimensity 9500: CPU Architecture and Performance
The Dimensity 9500 utilizes an octa-core CPU with a 1+3+4 configuration:
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1 Cortex-X930 “Travis” core running up to 4.21 GHz, acting as the prime core for heavy tasks.
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3 Cortex-A730 “Alto” cores clocked at 3.5 GHz for balanced performance.
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4 Cortex-A730 “Gelas” efficiency cores running at 2.7 GHz for power-saving tasks.
Travis and Alto are the latest iterations from ARM’s X9 series, while Gelas is an upgrade on the A7 design. This combination aims to deliver a smooth mix of speed and energy efficiency suited for demanding smartphone workloads.
GPU, AI, and Memory Highlights
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The GPU is the brand-new ARM Mali-G1 Ultra MC12, featuring 12 cores and an all-new microarchitecture. It offers:
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A 40% increase in energy efficiency.
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Advanced real-time ray tracing capabilities, with frame rates exceeding 100fps.
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Dimensity 9500 also boasts:
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16MB L3 cache and 10MB system-level cache (SLC) for fast data access.
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Support for SME (Scalable Matrix Extension) instruction set, enhancing AI and machine learning workloads.
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NPU 9.0 delivering up to 100 TOPS (trillion operations per second) for AI computation—doubling the previous generation’s capability.
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Memory compatibility with LPDDR5X at 10,667 Mbps and support for UFS 4.1 storage for high-speed file transfers.
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Devices Expected to Launch with Dimensity 9500
Among the early adopters are the upcoming smartphone lineups:
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Vivo X300 series, including the Vivo X300 and X300 Pro.
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Oppo Find X9 series with rumored 7,025mAh batteries and flagship features.
These devices will be the first to showcase the power efficiency and AI capabilities unlocked by the Dimensity 9500 chip.
Competitive Landscape and Market Impact
The MediaTek Dimensity 9500 is set to challenge rival flagship processors such as Qualcomm’s Snapdragon 8 Elite Gen 5. With its advanced process node, powerful CPU/GPU, and high AI throughput, the chip aims to deliver flagships that balance raw power with energy efficiency.
The 2nm process also helps device makers build slimmer, cooler, and longer-lasting smartphones, meeting modern consumer demands more effectively.
Frequently Asked Questions (FAQ)
When is the MediaTek Dimensity 9500 launching?
The Dimensity 9500 chipset will launch officially on September 22, 2025.
What manufacturing process is used for Dimensity 9500?
It is built on TSMC’s advanced 2nm N2P process, one of the latest in semiconductor fabrication technology.
What CPU cores does Dimensity 9500 have?
It has an octa-core setup: 1 high-performance Cortex-X930 core, 3 Cortex-A730 cores, and 4 efficiency Cortex-A730 cores.
What GPU does Dimensity 9500 include?
The chip features an ARM Mali-G1 Ultra MC12 GPU that supports enhanced ray tracing with up to 100+ fps frames.
How powerful is the AI engine in Dimensity 9500?
It includes the NPU 9.0 capable of performing up to 100 TOPS, significantly boosting AI-based tasks.
MediaTek’s Dimensity 9500 represents a major leap forward in mobile SoC technology with its 2nm manufacturing process, optimized core architecture, and powerful AI processing capabilities. Slated for release this September, this chip promises to power next-generation flagship smartphones with unparalleled efficiency, gaming performance, and AI features.
Early signs indicate that devices like Vivo X300 and Oppo Find X9 will lead the charge in showcasing this innovative platform, reshaping the Android smartphone performance landscape in late 2025 and beyond.