It will receive a reduced motherboard
Well-known analyst Ming-Chi Kuo has shared new insider data that Apple is going to introduce polymer-coated copper components (RCC) into the iPhone motherboard, reducing the thickness of the motherboard.
“RCC will reduce the thickness of the motherboard, save internal space, and make drilling easier due to the absence of fiberglass,” the analyst writes. “However, RCC will not be used in the 2024 iPhone 16 due to its fragile characteristics and inability to pass drop tests.”
An interesting feature of the iPhone 17 has been named
The rumor that Apple will start using RCC technology for the iPhone 16 appeared quite recently, but Ming-Chi Kuo claims that we will have to wait a couple more years.
Currently, Ajinomoto is the leading supplier of RCC materials. If Apple and Ajinomoto can improve the RCC material before the third quarter of 2024, it will be used in the new high-end iPhone 17 2025 models.
The iPhone 17 lineup is expected to be launched in September 2025.
