Judging by the picture, the thickness of the promising smartphone will not exceed the thickness of a stack of six plastic cards, which is about 5 mm. In addition, the photo reveals one of the colors in which the future smartphone will be made. This is a gradient from a whole palette of colors, similar to the iridescent finish of the Realme X7 Pro and Realme V15. The back panel bears the slogan of the company “Dare to Leap”, written in large letters. On the bottom end of the case is a polyphonic speaker grill, a USB Type-C port, a microphone hole, and, probably, a slot for SIM cards and memory cards, which may mean that the device does not have a 3.5 mm headphone jack. True, it may end up on the top of the smartphone, but the chances of this are slim.