Xiaomi showed the insides of the affordable flagship Poco F3 – there is even a heat pipe
On Monday, Xiaomi unveiled a new near-flagship smartphone, Poco F3, based on the Snapdragon 870 chipset. The company has now shared on Twitter a disassembly video of the device showing its internal layout.
Poco f3The video starts by removing the back panel of the device, after which a view of the internal layout of the smartphone opens. Interestingly, an additional microphone, flash LED, and light sensor are mounted directly on the inner cover that covers the smartphone’s board.
Removing this cover reveals the main board of the device. It contains a Snapdragon 870 chipset combined with an LPDDR5 RAM module and a UFS 3.1 drive. A Wi-Fi 6 receiver is located nearby. A metal heat-distributing cover covers these components on the board.
Curiously, the sensors of the main camera are not combined into one unit. This allows you to easily replace each sensor separately, which reduces repair costs and increases the device’s maintainability.
The video also showcases the device’s smaller components, such as the dual-axis vibration motor, speakers, USB-C board, and more.
