Google Pixel 8 packaging confirms the design and characteristics of the smartphone

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It will be released this month

The Mydrivers website published real photos of the packaging box of the Google Pixel 8 smartphone.

The top of the box shows that while the Pixel 8’s camera layout is the same as that of the Pixel 7, the modules themselves are larger than those of the Pixel 7. The smartphone is expected to have larger optical format sensors than its predecessor.

Google Pixel 8
Google Pixel 8

Google Pixel 8 packaging confirms the design and characteristics of the smartphone

Based on the back of the packaging, Google Pixel 8 will support the 5G Sub-6GHz frequency band. The screen diagonal is 6.2 inches, and well has 128 GB of flash memory. The kit will include a fast charging adapter and a data cable.

Google Pixel 8 is rumored to be powered by Google’s latest Tensor G3 chip. This chip is based on Samsung’s 4nm process and has a 9-core design consisting of an ultra-large Cortex X3 core at 2.91 GHz, four Cortex A715 cores at 2.37 GHz, and four small Cortex A510 cores at 1.7 GHz, as well as the Mali G715 GPU.

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