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Home MediaTek

MediaTek Dimensity 8300 SoC specifications revealed – potentially it will be a powerful platform

According to its characteristics, MediaTek 8300 is similar to the flagship Dimaensity 9200

MediaTek has performed powerfully in the top segment this year: the single-chip Dimensity 9300 has outperformed the Qualcomm Snapdragon 8 Gen 3. Next up is the release of a new SoC MediaTek sub-flagship class – Dimensity 8300, and, according to published data, it will be very similar to the ex-flagship Dimensity platform 9200.

MediaTek Dimensity 8300 SoC
MediaTek Dimensity 8300 SoC

MediaTek Dimensity 8300 SoC specifications revealed – potentially it will be a powerful platform

The Dimensity 8300 CPU will be three-cluster, with one Cortex-X3 core with a frequency of 2.8 GHz, three Cortex-A715 with a frequency of 2.4 GHz and four Cortex-A510 with a frequency of 1.6 GHz. As for the GPU, its role will be performed by the Mali-G615 MC6.

So far, the most powerful platform in sub-flagship smartphones is the Snapdragon 7+ Gen 2, but on paper the Dimensity 8300 looks more interesting (Cortex X3 core instead of Cortex-X2, Cortex-A715 core instead of Cortex-A710). It is very possible that the Dimensity 8300 will outperform the Snapdragon 7+ Gen 2.

The official premiere of MediaTek Dimensity 8300 will take place on November 21. According to rumors, the first smartphone based on it will be Redmi K70E.

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Tags: Dimensity seriesmediatekMediaTek Dimensity 8300 SoCMediaTek innovationMobile Chipsetmobile devicesmobile processorprocessor performanceProcessor Specifications.smartphone technologySystem on Chip

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