In addition, the South Korean manufacturer plans to expand the range of solid-state drives of its own production
Commenting on the financial results of the first quarter of 2020, SK Hynix confirmed that it will begin mass production of the next-generation 128-layer 3D NAND flash memory during the second quarter of 2020, that is, until the end of July.
Thus, the South Korean manufacturer is moving from the 96-layer 3D NAND flash memory, which accounted for the bulk of the release in 2019, to the next-generation memory. The new memory will be available in TLC and QLC variants, that is, with cells capable of storing three and four bits, respectively.
In addition, the manufacturer noted that in the current quarter it plans to expand the range of solid-state drives of its own production with a PCIe interface, including due to new form factors, which will allow us to capture more market segments.
