In addition, for the first time in the history of game consoles, the manufacturer used liquid metal as a heat-conducting interface between the processor and the radiator.

Sony has also completely redesigned the power scheme and power of the console’s hybrid processor, trying to optimize the technology to reduce the speed and power consumption of the APU when launching certain games. The AMD Ryzen APU used in the set-top box can dynamically change the frequency of the processing and graphics cores, and the power supply now supplies a constant voltage to the APU, system components, and fan.

However, the manufacturer did not limit himself to hardware alone. To ensure maximum efficiency and at the same time, the quiet operation of the set-top box, Sony uses a dynamic fan speed control system in the PlayStation 5 through software game updates. When you launch a game, Sony will be able to collect the temperature readings of the game console. If the temperature inside the console rises noticeably, for example, while playing Cyberpunk 2077, then Sony can find out and then use the data to remotely manually adjust the speed of the cooling fan. Game developers will also be able to take advantage of dynamic temperature control technology, and then include more optimal CO fan speed settings in the next game patch.

In a recent interview with 4Gamer, PlayStation 5 lead engineer Yasuhiro Ootori revealed that there are four temperature sensors inside the console that control fan speed. Three are on the motherboard of the set-top box itself, another one is located inside the APU. The fan speed can be dynamically adjusted via software updates that require an internet connection.

“There will be many different games released for the console in the future. Information about APU behavior in each of these games will be collected. We plan to optimize the speed of the set-top box CO fan based on these data, ”said Ootori.